IT House News on December 5, according to foreign media tomshardware news, Twitter user @VadimYuryev posted a real shot of the core of the Apple M1 Max chip, showing the real structure for the first time. Different from Apple’s official rendering, there is a larger area on the edge of this chip, which is not shown in the rendering. This user said that just by flipping this chip, it can be interconnected with the same chip to form an MCM multi-chip package architecture to further improve performance.
IT Home is informed that Apple’s current M1 Max chip contains 10 CPU cores and 24 or 32 GPU cores. It is manufactured using TSMC’s 5nm process technology and has 57 billion transistors. If Apple’s chip can be packaged together in multiple pieces, it is expected to achieve more powerful performance, and save development costs, without the need to redesign.
At present, only the M1 Max has additional integrated circuits that can be used for interconnection, while the M1 Pro series chips have not found hidden parts. The core real shots are consistent with the official renderings.
If Apple’s M1 Max chip can achieve multi-chip packaging, it will be able to support 128GB of memory, and the memory bandwidth can also be expanded to 800Gb/s, which can be used for graphics workstations and other purposes. At the same time, the power consumption is greatly reduced compared to traditional solutions.